Qualcomm is coming after eSIMs. The chip maker, along with French tech company Thales, has announced the certification of the world’s first commercially deployable iSIM on the Snapdragon 8 Gen 2 Mobile Platform.
What is iSIM?
The “i” in iSIM stands for “integrated.” It is currently being presented as an additional option to eSIMs, or embedded SIMs. But let’s face it, when the tech becomes cheaper (considering that Snapdragon 8 Gen 2 is a high end SoC) to offer to end customers, it’s likely to replace eSIMs.
As smartphones became slimmer, eSIMs were introduced with the idea of kicking out physical SIM card slots. They’re also very useful for painlessly switching between carriers. But offering eSIM capabilities means that phone manufacturers have to include standalone eSIM chips in their devices.
On the other hand, Qualcomm’s Snapdragon 8 Gen 2 platform has iSIM, or Integrated SIM, functionality baked right into the processor. There’s no need for a separate component, which means that it takes up even lesser space than a physical SIM card or eSIM. And its power requirements are slightly lower too.
iSIM integrates SIM technology on the chipset in a space that’s less than 1 sq mm. That’s how small of a footprint it boasts of. This gives manufacturers the option to make their phones even slimmer, or incorporate additional components, thanks to the space savings.
SIM technology takes another leap as the world's first Integrated SIM is launched by Thales and trusted partner @Qualcomm.
Discover here how the iSIM expands the capabilities and efficiency of mobile technology.https://t.co/6rtSwHSnB1#MWC2023 #DigitalID #DataPrivacy pic.twitter.com/SRQGKMcWg5
— Thales Group (@thalesgroup) February 28, 2023
The GSMA security certification Qualcomm’s showing off means that the iSIM meets the same standards of cyber-security and flexible connectivity as the latest generation of embedded SIMs (eSIMs).
“Alongside the increasingly popular eSIM, the Thales 5G iSIM gives device makers and mobile operators even greater freedom to offer their customers effortless over-the-air connectivity, and more exciting and accessible product designs,” said Guillaume Lafaix, vice president of embedded products at Thales Mobile and Connectivity Solutions.
Qualcomm and Thales have mentioned that according to Kaleido Intelligence, global iSIM shipments are likely to reach 300 million by 2027. Their iSIM technology is intended to complement the SIM and eSIM market.
